Research of analog, digital, mixed-signal, and RF Integrated Circuits (IC) design for a variety of applications, including high-speed wireline and wireless communications, data, converters, low-power medical devices and instrument, automotive radar, and devices and circuits for radiation, extreme temperature and other hard environments.
Students use Computer Aided Engineering (CAE) Tools for Structured Digital Design and work with advanced foundries such as TMSC to fabricate the design. The SICSL allows students to validate the fabricated chips/devices by testing them under varying conditions.
Contact: Scott McWilliams, Lab Manager
Key Faculty: Dr. Ping Gui, Dr. Jennifer Dvorak, Dr. Ron Rohrer