Laser MicroMachining

Laser Micromachining: Short Pulsed Nd:YVO4

Process Description

 
 Layout for Laser MicroMachining

Applications

  • Micromachining of traditionally hard and brittle materials: Micro milling, drilling, cutting. 
  • Solar Cells and Semiconductor Wafer dicing, scribing, texturing 
  • Glass marking
 LASER MICROMILLING AND TEXTURING OF SILICON WAFER (COLORed Polished)
 DI =75%; UV266 P=0.45 W, RR= 50 kHz, Passes=1000; Marking time =245 sec