•D.C. Lin, R. Kovacevic, et. al. (2007), An Investigation of the Influence of Nanoparticle Reinforcements on Microstructural Development in Lead Free Tin-Silver Solder. International Journal of Nanomanufacturing, Vol. 1, No. 3, 357-369.
•D.C. Lin, R. Kovacevic, et. al. (2006), Microstructural Development of a Rapidly Cooled Eutectic Sn-3.5% Ag Solder Reinforced with Copper Powder, Powder Technology. Vol.166, pp38-46.
•Dimitrovska, A. and Kovacevic, R., ”Mitigation of Tin Whiskers Growth by Applying Multiple Ni/Sn Plating Prior to the Final Sn Finish”, the Journal of Electronic Materials, Vol.38, No. 12, 2009, pp. 2516 – 2524.
•Dimitrovska, A. and Kovacevic, R., ”The Effect of Micro-alloying of Tin Plating on Mitigation of Tin
Whiskers Growth”, IEEE, the Journal of Electronic Materials, Vol. 38, No. 12, 2008, pp. 2726-2734.